"US researchers have developed a prototype device that creates a "breeze" made up of charged particles, or ions, to cool computer chips. Conventional cooling technologies using fans are limited because they can suffer from air-flow problems. As the spinning blades waft air over a chip, the molecules nearest to the chip can get stuck and remain stationary, hindering the cooling effect.
But the new experimental wind engine employs a different strategy.
The prototype, which is attached to a mock computer chip, works by shifting charged particles from one end of the device to the other. As a voltage is applied to the ionic engine, positively charged particles (ions) are produced, and are dragged towards a negatively charged wire (a cathode), forcing constant air movement."
The researchers say all this will translate into a 250% improvement over conventional air cooling. And that's okay, but the edge here is the collaboration Purdue University gets from Intel. That, and the fact that the device is expected to be introduced into products within the next three years.
Link: BBC News.
Artic Silver may be the first name people mention
when they are asked about a thermal paste manufacturer, but their
products have all one thing in common: they are solid.
When it comes to air cooling, there's nothing better than a 120mm heatsink-fan combination but, sometimes, this kind of cooler might be incompatible with your motherboard, or you have to forget about a couple of DIMM sockets (if the heatsink is of a square shape). In this case, you can always look at the next step dowm the ladder, the 90mm coolers, but that's giving up a lot of cooling performance... isn't it?
Thermo-Electric cooling is used with conventional heatsinks to achieve sub-ambient temperatures. Water cooling aims to dissipate as much heat as needed. Could a combination ot the two reach both goals?
By popular demand, silentpcreview finally decided to include this fan in their second part of "

