Last month's Consumer Electronics Show continues to provide us with new products. In this case, a new one presented by OCZ Technology Group that should appear shortly on their webpage (the image above still depicts the current incarnation of their Flex technology).

Continuing with their role as a leader in the high performance memory market, OCZ has improved on it's already fantastic heatsink design. Flex 2, offers superior cooling capacity due to dedicated liquid channels. The previous version channelled water over the top of the module, whereas now the liquid goes over the chips themselves (on both sides). The number of tubes gets doubled and reaches a total of eight for a two module memory kit.

Because of the need for the coolant to run directly above the memory chips, heat spreaders are thicker than usual, so you can forget about installing them in continuous slots. This limits the amount of modules to only two, but you will be relieved by not having to deal with 16 water connections.

Link: Legit Reviews.

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