The guys at Club Overcloker have compared several thermal compounds using a Q6600 stepping G0 processor as the source of heat.
The test participants are: Artic Silver 5, Ceramique, AI Technology's Cool Silver and the IC Diamond 7 Carat. As a point of reference, the stock grease from the Intel retail heatsink was also included (as well as the heatsink itself).
Under load, if any can claim a victory it should be Intel's stock. I guess this just shows how difficult it is to get a clear benchmark result with this kind of products. It could also mean that Intel has improved the paste significantly.
At idle, AS5 wins by a large margin, even though the 200 hours that are recommended for it to settle were not observed.
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