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Written by Maxit
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Monday, 12 March 2007 19:44 |
Neoseeker has published a review of OCZ's massive Flex XLC PC2-9200 memory. What makes this memory stand out so much, aside from its huge 1150MHz stock speed? It sports a massive silver heatspreader to which you can connect standard watercooling hoses. That's right, the heatspreaders support watercooling.
http://www.neoseeker.com |
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Written by Maxit
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Monday, 12 March 2007 19:28 |
Crucial are well known for their extreme Ballistix range of memory kits. In the past XSR has reviewed their PC3200 and 6400 dual channel modules. XS Reviews have the pinnacle of Crucial Ballistix memory kits, the PC8000. Like the DDR PC4000-4800 kits of old these modules promise stable overclocks but will they deliver?
http://www.xsreviews.co.uk |
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Written by Maxit
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Sunday, 11 March 2007 15:02 |
Patriot Memory make some decent DDR and now they should the big boys how to do it with some rather sexy PC2-8500 ram. The modules come with the industry must have lifetime warranty (with people living longer lives do you think this still applies?) and black aluminum heat spreaders to facilitate in dispersing the heat generated - hello overclocking. Find out if these modules are WMD or just MIA with overclockersclub.
http://www.overclockersclub.com/ |
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Written by Maxit
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Tuesday, 06 March 2007 10:34 |
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OCZ continue to improve their ever popular range of overclockers and high performance memory with innovative cooling solutions. The OCZ PC2-8500 Reaper HPC Series. This 2GB dual channel kit features
the proprietary OCZ Reaper HPC (Heat Pipe Conduit) heatspreader,
engineered to deliver superior silent heat dissipation over traditional
heatspreaders.
 New Cooling Technology From OCZ
The Reaper HPC is an innovative cooling solution developed by OCZ to
effectively minimize heat produced by high-speed memory. As heat rises
into the thermo-conductive copper heat pipe conduit, it is dissipated
through the strategically-placed compact aluminum fin array. By guiding
performance-robbing heat away from key memory components, the unique
Reaper HPC design helps facilitate improved overclocking performance,
while improving longevity and stability of the modules. |
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Written by Maxit
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Wednesday, 21 February 2007 05:32 |
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According to an article on Dialytech, memory manufacturer Super Talent in
partnership with Samsung has developed the world's first DDR3 RAM
module prototype modules and they claim that they will be the first ones to go for a
commercial release.
DDR3 is expected to be a significant step forward as a memory standard.
Not only is it a successor to the current standard DDR2, it holds a
number of technological advantages over the previous generation like power consumption being reduced to 1.5V and significantly higher clock speeds. The RAM modules will be
available in speeds ranging from 800 to 1600 MHz.
DDR3 memory is very similar to DDR2 memory in looks expect for the middle notch being located at different positions because of which they will not be backward compatible with current boards. These new modules are expected to be available in a few months time.
The first motherboards supporting the new memory standard will also be out at almost the same time as the modules and they will be based on Intel's new P35 chipset. This new chipset supports both DDR2 or DDR3 modules, but not both at the same time.
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Thursday, 08 February 2007 07:54 |
G.Skill has just announced the launch of two new high capacity memory modules for laptops. The DDR2-667 CL5 and the DDR2-533 CL4 2GB SO-DIMM memory modules extend the already popular family of memory modules manufactured by G-Skill.
According to G.Skill CEO, Johnson Huang, “As the laptop market is extending fast, we have now provided these 2GB modules to make the laptop cope with Microsoft Vista. We use the hundred percent copper heatsink with 2.4Kw/mk high thermal conductivity pad, to lower the heat resistance. Thermal conductivity is the key issue for laptop users. We believer this copper heatsink can make your laptop faster and more stable.”
Both the DDR2-533 SA and the DDR2-667 SA Series will be available through G.Skill’s authorized resellers and distributors all over the world.
DDR2-533 SA Series Features
- Guaranteed clock speed of 533MHz (PC2-4200)
- Low latency settings of 4 (CL), 4 (TRCD), 4 (TRP), 12 (TRAS)
- Lifetime warranty
- Available in the following packages: F2-4200CL4S-2GBSA - Single Module of 2GB
DDR2-667 SA Series Features
- Guaranteed clock speed of 667MHz (PC2-5300)
- Low latency settings of 5 (CL), 5 (TRCD), 5 (TRP), 15 (TRAS)
- Lifetime warranty
- Available in the following packages: F2-5300CL5S-2GBSA - Single Module of 2GB
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Friday, 12 January 2007 07:40 |
PNY Technologies has announced the upcoming availability of its new XLR8 2GB memory kits. Each 2GB memory kit contains two matched 1GB modules, each fitted with PNY's new proprietary heat sink design.
PNY Technologies' XLR8 Gold memory modules incorporate an innovative PCB (Printed Circuit Board) design that locates all the memory ICs on one side of the board. This configuration allows for the opposite side of the PCB to be used to attach a massive heat sink that extracts heat from the underside of the ICs through a custom expanded ground plane.
All XLR8 memory modules are tested to perform at their rated speeds and timings using a selective qualification process reserved exclusively for XLR8 memory. PNY's new XLR8 Extra Low Latency Performance Memory includes:
- 800 MHz PC2-6400 – Modules perform at latency settings of 4-4-4-12 at 2.1 volts. MSRP $329.99
- 800 MHz PC2-6400 – Modules perform at latency settings of 3-4-4-8 at 2.2 volts. MSRP $499.99
- 1066 MHz PC2-8500 – Modules perform at latency settings of 5-5-5-15 at 2.2 volts. MSRP 429.99
The modules will be available in March through PNY's worldwide network of reseller, distribution, retail and e-tail partners, and also include the company's lifetime replacement warranty and technical support.
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Friday, 24 November 2006 11:55 |
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OCZ Technology Group, a worldwide leader in innovative, ultra-high
performance and high reliability memory, today unveiled the OCZ
PC2-9200 FlexXLC 2x1GB Kit, a revolutionary new memory solution that
offers unprecedented speed, signal integrity, and thermal management.
These new modules feature the new OCZ FlexXLC heatsink that delivers
superior heat dissipation via a hybrid copper and aluminum design
alterable between passive air or water cooling. As the World’s fastest
DDR2, the PC2-9200, in combination with the innovative FlexXLC
technology, is considerably the most ground-breaking and unique memory
product existing today.
The latest generation of DDR2 modules by far exceeds the original
projections of the DDR2 design triggering a need for amendments in the
operating specifications. For example, operating voltage, originally
defined as 1.8V, has increased to typically 2.1V or even higher to
reach 1GHz+ frequencies. In the case of a DDR2 module running at 1200
MHz and 2.1V supply voltage, this entails that the power consumption
increases many times over that of the same module running at 400 MHz
and 1.8V supply voltage. Power consumption, in turn, directly
translates into heat dissipation.
PRODUCT URL: http://www.ocztechnology.com
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Monday, 06 November 2006 03:57 |
OCZ Technology expands their award winning Titanium series of memory with some new PC2-6400 modules. Rated with a 1T command rate and CAS 4 latency, the modules are also
equipped with enhanced performance profiles for better compatibility
with nForce 590 SLI based motherboards.
The PC2-6400
Titanium modules will only be available in 1GB units with dual channel kits available for best performance in current operating systems.
Full press release after the click.
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Friday, 20 October 2006 20:25 |
Samsung has announced that it has manufactured the first 50nm DDR2 DRAM chip, increasing efficiency to 55% more than the same chip on a 60nm process. Smaller processes, in any computer industry, allow the manufacturer to reduce manufacturing costs, create devices with lower power consumption, and get a higher yield off the assembly line. Basically, it's an all-around good thing, once the manufacturing plants are built.
The new DRAM chip utilizes new 3D transistors, a new technology that allows for easier transfer of electrons and, as a result, less power usage. In addition, the smaller process allows for the use of a multi-layer dielectric, which results in more stability of data and higher storage capacities.
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