G.Skill has just announced the launch of two new high capacity memory modules for laptops. The DDR2-667 CL5 and the DDR2-533 CL4 2GB SO-DIMM memory modules extend the already popular family of memory modules manufactured by G-Skill.
According to G.Skill CEO, Johnson Huang, “As the laptop market is extending fast, we have now provided these 2GB modules to make the laptop cope with Microsoft Vista. We use the hundred percent copper heatsink with 2.4Kw/mk high thermal conductivity pad, to lower the heat resistance. Thermal conductivity is the key issue for laptop users. We believer this copper heatsink can make your laptop faster and more stable.”
Both the DDR2-533 SA and the DDR2-667 SA Series will be available through G.Skill’s authorized resellers and distributors all over the world.
DDR2-533 SA Series Features
- Guaranteed clock speed of 533MHz (PC2-4200)
- Low latency settings of 4 (CL), 4 (TRCD), 4 (TRP), 12 (TRAS)
- Lifetime warranty
- Available in the following packages: F2-4200CL4S-2GBSA - Single Module of 2GB
DDR2-667 SA Series Features
- Guaranteed clock speed of 667MHz (PC2-5300)
- Low latency settings of 5 (CL), 5 (TRCD), 5 (TRP), 15 (TRAS)
- Lifetime warranty
- Available in the following packages: F2-5300CL5S-2GBSA - Single Module of 2GB






