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| Samsung Develops a Way to Make 16GB Flash Chips |
| Friday, 10 November 2006 20:40 |
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Flash memory seems to be getting bigger and bigger every day. Recently Samsung announced a new process they have developed that enables them to mass-produce much larger flash chips than they already have. The new technology allows them to stack 16 individual chips together as one single multi-chip package (MCP). Combined with their current maximum single chip capacity of 1GB, that gives you a 16GB flash chip, which cold be used in all sorts of different portable products. The production process works by allowing the company to make their flash wafers about 35% thinner than before, which lets them put more chips in the same package. The height of the overall chip is lowered largely due to a thinner adhesive layer between chips, reduced from 60 microns down to 20 microns. There is no word on when these new chips will be commercially produced. Original article by TGDaily.
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